Last edited by Fegami
Thursday, July 9, 2020 | History

3 edition of Proceedings 2002 23rd International Conference on Microelectronics found in the catalog.

Proceedings 2002 23rd International Conference on Microelectronics

Nis, Yugoslavia 12-15 May 2002

by Yugoslavia) International Conference on Microelectronics (23rd : 2002 : Nis

  • 179 Want to read
  • 6 Currently reading

Published by Electron Devices Society .
Written in English

    Subjects:
  • Electronics engineering,
  • Mathematics and Science,
  • Electronics - General,
  • Computer Simulation,
  • Electronics - Microelectronics,
  • Technology & Engineering,
  • Technology & Industrial Arts,
  • Science/Mathematics

  • The Physical Object
    FormatPaperback
    Number of Pages794
    ID Numbers
    Open LibraryOL11000255M
    ISBN 100780372352
    ISBN 109780780372351

      In: Proceedings of the 1st international IEEE conference on polymers and adhesives in microelectronics and photonics, pp – Google Scholar Shi SH, Yamashita T, Wong CP () Development of the wafer-level compressive-flow underfill process and its required materials. Microelectronics Reliability 40 (2), , 23rd International Conference on Microelectronics. Proceedings (Cat. No , Timing simulation of digital circuits with binary decision diagrams. R Ubar, A Jutman, Z Peng. Proceedings Design, Automation and Test in .

    ICSE, the International Conference on Software Engineering,® is the premier software engineering conference, providing a forum for researchers, practitioners and educators to present and discuss the most recent innovations, trends, experiences and concerns in the field of software engineering. Proceedings of the 12th International CDIO Conference. Larsen, Bjørn B.; Lundheim, Lars Magne. () The Electronic Engineering Step Ladder. 10th European Workshop on Microelectronics Education, (EWME).

    Scientific Computing in Electrical Engineering June, 23rd - 28th, , Eindhoven, The Netherlands. Purpose of the conference The aim of this workshop series is to bring together scientists from universities and industry with the goal of intensive discussions about modeling and numerical simulation of electronic circuits and of electromagnetic fields. Fourth International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC): proceedings: February , , Santa Clara Marriott Hotel, Santa Clara, CA: a specialty conference of Institute on Microelectronics Inter-chip Connection [].


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Proceedings 2002 23rd International Conference on Microelectronics by Yugoslavia) International Conference on Microelectronics (23rd : 2002 : Nis Download PDF EPUB FB2

Microelectronics,MIEL23rd International Conference on. MIEL 23rd International Conference on Microelectronics: Responsibility: organized by Yugoslavia IEEE Section, EDS/SSC Chapter ; under technical co-sponsorship of the IEEE Electron Devices Society ; with the cooperation of IEEE Solid-State Circuits Society.

Get this from a library. 23rd International Conference on Microelectronics: proceedings: MIEL Niš, Yugoslavia, May, [IEEE Electron Devices Society.; Yugoslavia IEEE Section.

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NoTH) Location: Nis, Serbia; 23rd International Conference on Microelectronics. Proceedings (Cat. Published in: 23rd International Conference on Microelectronics.

Proceedings (Cat. NoTH) Article #: Date of Conference: May Date Added to IEEE Xplore: 07 August ISBN Information: Print ISBN:. Edition of Conference Proceedings and Book 1 Special issue on "Nanotechnology inGreece", published the International Journal of Nanotechnology, vol.

6 (Nos 1/9)Editors: A. Nassiopoulou, C. Fotakis 2 Edition of the Proceedings of the 6th International conference on Porous Semiconductor Science and Technology (PSST ). Special Issue of Physica.

Basaran, Cemal, and Jiang, Jianbin. "Elastic Modulus of Pb/Sn Solder Joints in Microelectronics." Proceedings of the ASME International Mechanical Engineering Congress and Exposition. Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology.

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ACM. Get this from a library. Proceedings, International Conference on Advanced Packaging and Systems: March, Reno Hilton Hotel, Reno, Nevada. [International Microelectronics and Packaging Society.; Society of Photo-optical Instrumentation Engineers.;].

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Get this from a library. POLYTRONIC 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: conference proceedings: June, Hotel Balaton, Zalaegerszeg, Hungary. [Budapesti Műszaki és Gazdaságtudományi Egyetem. Department of Electronics Tehnology.;].

Book Description The 26th International Conference on the Physics of Semiconductors was held from 29 July to 2 August at the Edinburgh International Conference Centre. It is the premier meeting in the field of semiconductor physics and attracted over participants from leading academic, governmental and industrial institutions in some.Artiklid/peatükid lisas loetletud kirjastuste välja antud kogumikes (kaasa arvatud Thomson Reuters Book Citation Index, Thomson Reuters Conference Proceedings Citation Index.

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; Shadi Banitaan, Saeed Salem, Wei Jin and Ibrahim Aljarah.